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WM168 |
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Sweep sensor
- Advanced HD3D active-pixel sensing
- Maximum finger speed: Up to 40 cm/s
- Sensor strip (image) width: 7.2 mm
- Array width: 144 pixels
- Integrated bezel
- Pixel pitch: 50 microns
- Image resolution: 508 DPI
- ESD tolerance: ±30kV air discharge (Exceeds IEC 61000-4-2 Level 4)
- Ball Grid Array (BGA) 3 × 11, 1 mm pitch
- Black and stainless-steel bezel colors
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Companion Chip
- 32-bit RISC architecture
- Up to 144 MIPS
- 32 KB NVM available for biometric data
- More then 100,000 erase/write cycles
- More then 40 years data retention
- Package-Ball Grid Array (BGA)
- 8 mm × 8mm, 81 balls |
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Host Interface
- UART interface (Up to 230.4 Kbps)
- USB 2.0 full speed (12 Mbps) interface (under developed)
- SPI interface (under developed) |
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Power Consumption
- Deep sleep: 900 uA @ 3.3 V
- Stand-by mode (Finger detect active): 1150 uA @ 3.3 V
- Imaging mode: ~78 mA @ 3.3 V (sensor ~11 mA, companion chip ~67 mA)
- Wake-up time: <15 ms (Deep sleep or standby to imaging)
- Single supply voltage: 3.0 V to 3.6 V |
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Environmental Specifications
- Operating temperature:
- Sensor: -30° C to +70° C
- Companion chip: -40° C to +85° C
- Storage temperature: –40° C to +125° C
- Storage/operating humidity: 5% to 93% RH without condensation
- RoHS Complian |
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Applications
1. Desktop PC security
2. Mobile PCs
3. Portable storage devices
4. Custom application
5. Home and office use
6. Handheld devices and PDAs
6. Compatible with the Protector Suite Application family |
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